• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    1. A device for applying a solder to the PCB containing a solder bath, a slot with a hole for board passage, a vertical guide fixture fixed in the bath, nozzles installed between the solder bath and a lid, and additional collecting baths. Soldering, in contrast to the fact that, with a distance to improve the quality of soldering by eliminating damage to printed circuit boards, the guiding device was made as installed one opposite another, at intervals along the entire length of the bath, with two rows of rod-like directionals. Their elements with elastic protrusions bath ends and located one opposite the other with a passage slot of disk elastic guides mounted on the axes above the nozzles parallel to the rod-shaped guide elements, and additional baths for sat pa solder formed shnekovtmi semicircular and are provided with mechanisms to remove the solder. 2. A device according to claim 1, characterized in that the end ends of the rod-like guide elements are installed with gaps relative to the bottom of the bath, while the rows of guide elements are arranged obliquely with decreasing piacot or between them towards the bottom. 3. A device according to claim 2, about one that the rod-like guiding elements of one row are located opposite the respective guiding elements of the other row. 4. The device according to claim 3, which is based on the fact that the lower ends of the opposite rod-like guide elements are pairwise connected to each other. 5. The device according to claim 1, characterized in that it is. It is fitted with springs installed between the additional baths and the 55 upper ends of the rod-like guide elements. SP 6. The device according to P; 1, OT L Ichascheeshe so that it is clearly provided with clamps of rod-like guide elements attached to the walls of the bath. 7; A device according to claim 6, wherein the clamps are mounted at the level of the solder mirror in the bath.
    公开号:SU1144615A3
    申请号:SU813337802
    申请日:1981-09-08
    公开日:1985-03-07
    发明作者:Питер Карач Ханс
    申请人:Синтер Лимитед (Фирма)；
    IPC主号:
    专利说明:

    1 Iso5rPTP and S1TNOCHNTSY to soldering, l to the device for applying a solder on the board. A device for applying solders to printed circuit boards is known, which contains a solder bath, a kryat with a hole for passage of the boards, fixed 1-: a vertical guide device that is located in the shielding, nozzles installed between the solder bath and a lid and additional baths for collecting UDI. the need for accurate and time-consuming orientation of printed circuit boards for their entry into the channel direction. In some cases, printed circuit boards that easily flex, enter with difficulty or even enter. To process boards of various widths or olivins, you need to re-configure the winches to replace them with power: pin. Since the printed circuit boards in the hot tub are softened, side bobbins cause the danger of damaging the naked out of the printed circuit boards, which are not resistant to mechanical shock. The invention is an increase in soldering capacity by eliminating the reproducibility of printed circuit boards. The post-goal is achieved by the fact that in a device for applying npVinoH to printed circuit boards, containing a solder bath, a cover with a hole for passage of the boards, a vertical direction 1oa fixed in the bath; a device, nozzles installed between the solder bath and a lid, additional baths for collecting solder, the guide to the device was made in the form of one-placed: one opposite the other with gaps along the entire length of the bath with two rows of core-forming directions of 1.5 gos of elements with elastic - And protruding over the bath ends and located one opposite each other with the passage of the disk elastic directions set on the axes, with the nozzles parallel to the rod-shaped guide elements, and the additional baths for j: 6opa the solder is filled with semicircular and equipped with screw mechanisms for the removal of solder. seger ends; : The incongruent directional elements are set with a gap relative to dp eaiitM, at 15.2 of this row, the direction of the ax ecch is located obliquely with decreasing distance between) {them towards the bottom. Rod-like directional elements of one row are arranged and opposite to the corresponding guide elements of another row. The lower ends of the opposite rod-like guide elements are mutually interconnected. In addition, - the device is equipped with springs, installed between the additional: additional baths and the top ends of the surface of their elements. The device is equipped with latches. rod-shaped guiding elements fixed on stL; Solder mirrors in the bath. 1a of FIG. 1 shows a device for printed circuit boards, a cross-section; in fig. 2 - section aa and pa of fig. 1. The device comprises a housing 1, which is closed from above by a crinkle 2 having a slit-like shape. hole 3 for the passage of printed circuit boards. In the lower part of the housing 1 there is a bath 4 for solder, which is open from above opposite the opening 3, and from the bottom is closed by a mesh bottom 5 through which the bath is connected to a distribution chamber 6 provided at the base of the lower part of the housing. Between the walls of the bath 4 of the housing 1 there is formed a precast cavity 7 for soldering. Using pasas (not shown), the solder from the distribution chamber 6. is transported upwards through the bath 4, through which BepxHVse the edges of the walls of which the solder is poured into the collecting cavity 7, from where it again flows into the distribution chamber 6. The heater for heating the solder, which has a known construction , not shown. ) Three inoperative pump the mirror of the solder S of the solder bath is below the upper croc of the wall of the vanity 4.. Inside the bath 4, across the entire width, the rod-shaped guides 8 distributed at intervals reach the area of the mesh bottom 5 of bath 4 and protrude above the mirror S of the bath. The upper ends 9 and 10 form a narrowing 11 of the intermediate space 12.
    3114461
    The upper lute of the II lute of the 9 and 10 of the guiding elements of the elbow is elastically moved apart}, which is clamped by arms 13 and 14. In the area of the ripo S mirror the baths of the solder on the inner side of the opposite walls of the bath 4 are located 8. place a single latch 15 or 16 liters of guide elements 8 can l each element to provide its own lock, mounted on the wall of the bath 4. The clamps 15 and 16 are fixed at such a height that when the pump is running, they are at a small amount of protrusion Solder S is mounted above the mirror, so at any time you can check the fit of the 8 x 8 in these latches 15 and 16.
    Two nozzles 17 and 18 are located above the flowline 8, which extend across the entire width of the bath 4 and a gap 19 is placed between them, which is in the same plane with narrowing 11. The nozzles 17 and 18 are connected
    with a source of hot air. Parallel to the nozzles 17 and 18 — over the entire width of the bath 4, the semicircular baths 20 and 21, in which
    excessive solder jets of warm air. Screw mechanisms (not shown) in each of the baths 20 and 21 ensure that excessive solder is removed from the device before it is cured. Above the nozzles 17 and 18, guide disks 22 and 23 parallel to one another pass parallel to the nozzles 17 and 18 parallel to each other. Each of the flattening disks 22 and 23 has 40 bearing rods 24 or 25. Guides The disks 22 and 23 are capable of flexing elastically. Between the guide discs 23 and 22 there is a passage slot 26 which is on the same axis 45 with a hole 3 in the lid 2 and a gap 19 between the nozzles 17 and 18.
    The dotted line shows the printed circuit board 27, which is held by gripper-50 volume 28, shown schematically. The device works as follows.
    Pressed in the gripper, the printed circuit board 27 is inserted through hole 3 in 55 of lid 2 into the device between two guides of 5-5 discs 22 and 23, the task of which is this.
    54
    to make curved circuit boards 27
    without damage, guide between the nozzles 17 and 18 to the rails 8. Thereafter, the circuit board, through taper 11 between the opposite rails, is transferred to the intermediate space 12 between these rails. The width of this constriction 11 is somewhat larger than the thickness of the printed circuit board 27, which, if it is perfect. The plane passes without contact between the bends of the guides. Under the influence of the gripper 28, the upper ends 10 and 9 of the guide elements open and then again the original position due to their own elasticity or under the influence of the springs 13 and 14. When inserting the curved boards, the ends can also be moved apart, which ensures the introduction of the curved boards without damage from the guides 8 .
    After passage through narrowing 11. the printed circuit board enters the intermediate space 12 between the guides 8, which is significantly larger than the thickness of the printed circuit board 27. In the solder bath 4, then solder is applied to the printed circuit board 27.
    Since the guides 8 reach the mesh bottom zone 5, with these guides even curved G1 boards are held essentially to the center of the bath 4. The guides 8 prevent the printed circuit boards 27 from contacting the walls of the bath 4. Guides 8 (Fig. 1) at the bottom there is a gap, as a result of which the intermediate space 12 between these directional 1-gmi elements narrows. This further contributes to the correct positioning of even the curved printed circuit boards 27 in the center; baths 4.
    After the end of the tinning process, the circuit board 27 is again removed from the bath 4. At the same time, it passes through the constriction 11 and between the nozzles 17 and 18. During this movement, the circuit board 27 on both sides is exposed to jets of warm air coming out of the nozzles 17 and 18 These jets remove excessive solder and remove through-holes in the printed circuit board from the solder. After removing excess solder PCB 27 through pass through target 26
    I1
    and the opening 3 in the housing is removed from the device.
    Due to the distance: d11ms on both sides of the printed circuit board 27 directed to elements 8, which are distributed in a series with intervals across the entire width of the printed circuit board 27, a plurality of bright spots are formed, which provide a sufficient level of orientation and positioning without prolonged mechanical contact between printed circuit board 27 and directed nkhdnmi elements. The width of the constriction 11 is somewhat larger than the thickness of the printed circuit board 27, therefore the elements 8 of the direction of the YERD, i.e. their curves, do not touch the printed circuit board. Since the upper ends 9 and 10 are elastically bent, they can be elastically deflected if the seal of the board strikes into the bends. On the one hand, the printed circuit board is precisely oriented, and on the other hand, damage from the guides 8, which do not provide the board with any sign of any mechanical resistance, is prevented.
    Iodine by narrowing 11 the gap between the opposite guiding elements 8 becomes greater. This means that by judgment 11, usually JiJiKaKoro, there is no contact between the circuit board 27 and 1 and 1 of the 8 elements. Meanwhile fee 27
    D6156
    In Bainfe 4, the accessory (and on all sides does not overlap anywhere else with the guiding elements 8. Since the guides 8 act on the front and back of the board 27, which you do not need to guide along its edges, there is no need for an exact lateral positioning and it is possible to process printed circuit boards of various
    0 width without adjusting the guides 8.
    The device for tinning in separate parts can be made differently, the width of the gap between, at the bends, i.e.
    S the width of the constriction 11 can be varied by changing the forces of the springs 13 and 14 acting on the upper cogs 9 and 10. This is achieved, 1 for example, by using pruhgin with different characteristics. If the upper ends of the guiding elements 9 and 10 have the necessary elastic properties, then the fast 13 and 1A can be refused.
    25
    The guiding elements 8, which are opposite to each other, may not be tied to the BALANCES by the lower ends of each other. with a friend. In addition, the guiding elements may be offset by one
    0 relative to the other side.
    The proposed device makes it possible to eliminate the damage to the boards and, thereby, 2-5 improve the quality of the soldering.
    权利要求:
    Claims (7)
    [1]
    1. DEVICE FOR APPLICATION OF SOLDER ON PCBs, containing a solder bath, a roof with a hole for passage of boards, a vertical guide fixed in the bath, nozzles installed between the solder bath and the lid, and additional baths for collecting solder, about t and h The main point is that, in order to improve the quality of soldering by eliminating damage to the printed circuit boards, the guiding device is made in the form of installed one opposite to the other with gaps along the entire length of the bathtub in two rows of rod-shaped their elements with elastic ends protruding over the bath and positioned opposite one another with the passing slit disk elastic guides ustanovlennzh on the axes of the nozzles in parallel rod-shaped guide elements, and additional bath to collect solder is semicircular and is endowed wife ~ Screw conveyor for the removal of solder.
    [2]
    2. The device according to claim 1, characterized in that the lower ends of the rod-shaped guide elements are installed with a gap relative to the bottom of the bath, while the rows of guide elements are arranged obliquely with decreasing distance between them towards the bottom.
    [3]
    3. The device according to claim 2, characterized in that the rod-shaped guide elements of one row are located opposite the corresponding guide elements of another row.
    [4]
    4. The device according to claim 3, characterized in that the lower ends of the opposing rod-shaped guide elements are paired with each other ·.
    [5]
    5. The device according to p. 1, characterized in that it. equipped with springs installed between the additional bathtubs and the upper ends of the rod-shaped guide elements.
    [6]
    6. POP device; 1, Ο T ающееся, which is provided with latches of rod-shaped guide elements fixed to the walls of the bath.
    [7]
    7: The device according to claim 6, which is connected with the fact that the latches <are installed at the level of the solder mirror in the bath.
    . „, 1144615
    1 1 1
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    NL88301C|1900-01-01|
    US1479783A|1921-12-03|1924-01-08|Frank F Bentley|Soldering apparatus|
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    GB1446636A|1972-12-01|1976-08-18|Xerox Corp|Treating a printed circuit board so that the conductive areasthereof have a substantially uniform coating of solder thereon|
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    DE2836493C2|1978-08-21|1979-11-22|Siemens Ag, 1000 Berlin Und 8000 Muenchen|PCB holder|
    US4333417A|1979-12-13|1982-06-08|Camp Neal H|Coating system|US4541358A|1983-11-28|1985-09-17|The Htc Corporation|Method and apparatus for solder removal|
    US4608941A|1985-01-10|1986-09-02|Teledyne Electro-Mechanisms|Apparatus for soldering printed circuit panels|
    US4695481A|1985-03-28|1987-09-22|Senju Metal Industry Co., Ltd.|Method of performing plating of an item having fine parts and a support device therefor|
    US4776508A|1985-06-28|1988-10-11|Unit Design Inc.|Electronic component lead tinning device|
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    US5240738A|1991-12-31|1993-08-31|International Business Machines Corporation|Method of applying solder to a flexible circuit|
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    法律状态:
    优先权:
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